先进制程现状：近闻“涨声”，远听“炮声”
发布时间：2024/6/20 来源：奧仕途 
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TSMC is looking forward to achieving more than 200 billion transistors on a single chip in the next few years, and more than 1 trillion transistors through 3D packaging. This is an ambitious technological breakthrough plan formulated by TSMC. Intel CEO Pat Gelsinger also said, "Ubiquitous computing, infrastructure from cloud to edge, ubiquitous connectivity, and artificial intelligence are the four super technological forces of our time." When these bold words are projected onto advanced semiconductor process technology, we see optimistic market expectations, fierce competition, and subtle cooperation, as well as the considerable gap between domestic foundry and leading enterprises. Only by constantly moving forward can we hope to achieve a breakthrough.
